Dicom SANAQ® SP 205

Description

Co-processed excipient for direct compression of hygroscopic and moisture sensitive APIs. It contains Colloidal silicon dioxide to provide uniform microenvironment for high moisture absorbing capability and intimate adherence to the API.

Main Application

DiCom SANAQ® SP205, is a microcrystalline cellulose (MCC) based excipient, co-processed with colloidal silicon dioxide (CSD), binders and disintegrants.
It is a tailor made and specifically designed excipient for moisture sensitive and low bulk density / fluffy API’s.

Flow properties

Exellent and superior flow properties compared to simple physical blend on all the key parameters such as bulk density, repose angle, Hausner ratio and Carr index.

PSD

DiCom SANAQ® SP 205 has an average PSD of 300 – 600 microns.